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Chip-On-Board technology is among the most innovative fields of semiconductor technology. Individual LED chips are mounted on a gold-plated PCB by fully automated bonders. After that, components are contacted using gold wire.
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Chip-On-Board technology enables chip densities of up to 70 chips/cm2. In combination with substrates such as flexible PCBs and ceramics, COB technology opens up new and fascinating areas of applications, which could be realised only in part or not at all with conventional light technology.
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